Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8766417 | Integrated circuit chip with reduced IR drop | Shih-Hung Lin, Chih-Chien Huang, Tien-Chang Chang | 2014-07-01 |
| 8476745 | Integrated circuit chip with reduced IR drop | Shih-Hung Lin, Chih-Chien Huang, Tien-Chang Chang | 2013-07-02 |
| 7915744 | Bond pad structures and semiconductor devices using the same | Yang-Hui Fang | 2011-03-29 |
| 7678659 | Method of reducing current leakage in a metal insulator metal semiconductor capacitor and semiconductor capacitor thereof | Ming-Chieh Lin | 2010-03-16 |
| 7646087 | Multiple-dies semiconductor device with redistributed layer pads | Yang-Hui Fang | 2010-01-12 |