Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10676959 | Netting post cap | — | 2020-06-09 |
| 5777383 | Semiconductor chip package with interconnect layers and routing and testing methods | Abraham Yee, Gobi R. Padmanabhan | 1998-07-07 |
MS
Mark Phillip Stager
Overall (All Time): #1,909,746 of 4,157,543Top 50%
2
Patents All Time