Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806293 | Encapsulation film | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Seung Min Lee | 2017-10-31 |
| 9803112 | Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same | Suk Ky Chang, Yoon Gyung Cho, Kyung Yul Bae | 2017-10-31 |
| 9793103 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Jong Wan Hong, Hyo Sook Joo | 2017-10-17 |
| 9768386 | Composition for encapsulation film, encapsulation film, and electronic device comprising the same | Jung Sup Shim, Yoon Gyung Cho, Suk Ky Chang, Seung Min Lee, Kyung Yul Bae | 2017-09-19 |
| 9695345 | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same | Jang Soon Kim, Jong Wan Hong, Hyo-Soon PARK, Dong Han Kho | 2017-07-04 |
| 9698378 | Encapsulation film | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Seung Min Lee | 2017-07-04 |
| 9698379 | Encapsulation film | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Seung Min Lee | 2017-07-04 |
| 9659763 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Jong Wan Hong, Hyo Sook Joo | 2017-05-23 |
| 9577214 | Adhesive film and method of encapsulating organic electronic device | Yoon Gyung Cho, Seung Min Lee, Suk Ky Chang, Jung Sup Shim | 2017-02-21 |
| 9548473 | Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film | Seung Min Lee, Yoon Gyung Cho, Kyung Yul Bae, Jung Sup Shim, Suk Ky Chang +4 more | 2017-01-17 |
| 9422460 | Adhesive film | Suk Ky Chang, Jung Sup Shim, Yoon Gyung Cho, Seung Min Lee | 2016-08-23 |
| 9391293 | Adhesive film | Yoon Gyung Cho, Seung Min Lee, Suk Ky Chang, Jung Sup Shim | 2016-07-12 |
| 9343696 | Adhesive film | Suk Ky Chang, Seung Min Lee | 2016-05-17 |
| 9343702 | Adhesive film and method for encapsulating organic electronic device using same | Kyung Yul Bae, Seung Min Lee, Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim | 2016-05-17 |
| 9343697 | Adhesive film and sealing method for organic electronic device using same | Jung Sup Shim, Seung Min Lee, Suk Ky Chang, Yoon Gyung Cho, Kyung Yul Bae | 2016-05-17 |
| 9105648 | Adhesive and method of encapsulating organic electronic device using the same | Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang-Jin Jeong, Suk Ky Chang | 2015-08-11 |
| 9035545 | Organic light emitting device comprising encapsulating structure | Kwang-Jin Jeong, Min Soo Kang, Jong Seok Kim, Yoon Gyung Cho | 2015-05-19 |
| 8742411 | Adhesive film and method of encapsulating organic electrode device using the same | Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang-Jin Jeong, Suk Ky Chang | 2014-06-03 |
| 8541289 | Dicing die bonding film and dicing method | Jong Wan Hong, Jang Soon Kim, Hyo-Soon PARK, Dong Han Kho, Hyo Sook Joo | 2013-09-24 |
| 8207616 | Adhesive film, dicing die bonding film and semiconductor device using the same | Jong Wan Hong, Jang Soon Kim, Hyo-Soon PARK, Dong Han Kho, Hyo Sook Joo | 2012-06-26 |