Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10011743 | Dielectric adhesive film for electronic paper display device | Sang Hoon Lee, Chang Ik Hwang, Yeon-Soo Kim | 2018-07-03 |
| 9793103 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Hyun Jee Yoo, Jang Soon Kim, Hyo-Soon PARK, Jong Wan Hong, Hyo Sook Joo | 2017-10-17 |
| 9695345 | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same | Hyun Jee Yoo, Jang Soon Kim, Jong Wan Hong, Hyo-Soon PARK | 2017-07-04 |
| 9659763 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Hyun Jee Yoo, Jang Soon Kim, Hyo-Soon PARK, Jong Wan Hong, Hyo Sook Joo | 2017-05-23 |
| 9018303 | Acrylic pressure sensitive adhesive compositions having plasticizer | Hyun Ju Cho, Suk Ky Chang, Jang Soon Kim, Yoon Jung Baek | 2015-04-28 |
| 8541289 | Dicing die bonding film and dicing method | Jong Wan Hong, Jang Soon Kim, Hyo-Soon PARK, Hyun Jee Yoo, Hyo Sook Joo | 2013-09-24 |
| 8436122 | Pressure sensitive adhesive composition for transporting flexible substrate | Sang-Ki Chun, Se Ra Kim, Suk Ky Chang | 2013-05-07 |
| 8207616 | Adhesive film, dicing die bonding film and semiconductor device using the same | Jong Wan Hong, Jang Soon Kim, Hyo-Soon PARK, Hyun Jee Yoo, Hyo Sook Joo | 2012-06-26 |
| 8182913 | Bi-layer structured sheet having excellent printability when printed by hard roll and method for producing the same | Sang-Ki Chun, Dong-Wook Lee, In-Seok Hwang, Seung Wook Kim | 2012-05-22 |
| 8128773 | Pressure sensitive adhesive for transporting flexible substrate | Sang-Ki Chun, Suk Ky Chang | 2012-03-06 |