Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793103 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Hyun Jee Yoo, Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Hyo Sook Joo | 2017-10-17 |
| 9695345 | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same | Hyun Jee Yoo, Jang Soon Kim, Hyo-Soon PARK, Dong Han Kho | 2017-07-04 |
| 9659763 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Hyun Jee Yoo, Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Hyo Sook Joo | 2017-05-23 |
| 8541289 | Dicing die bonding film and dicing method | Jang Soon Kim, Hyo-Soon PARK, Hyun Jee Yoo, Dong Han Kho, Hyo Sook Joo | 2013-09-24 |
| 8207616 | Adhesive film, dicing die bonding film and semiconductor device using the same | Jang Soon Kim, Hyo-Soon PARK, Hyun Jee Yoo, Dong Han Kho, Hyo Sook Joo | 2012-06-26 |