Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12332042 | In-situ wafer thickness and gap monitoring using through beam laser sensor | Xuefeng Hua, Anthony Paul Van Selow, Daniel Torres, Jack Chen | 2025-06-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12332042 | In-situ wafer thickness and gap monitoring using through beam laser sensor | Xuefeng Hua, Anthony Paul Van Selow, Daniel Torres, Jack Chen | 2025-06-17 |