Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12332042 | In-situ wafer thickness and gap monitoring using through beam laser sensor | Goon Heng WONG, Xuefeng Hua, Daniel Torres, Jack Chen | 2025-06-17 |
| 10971384 | Auto-calibrated process independent feedforward control for processing substrates | — | 2021-04-06 |