Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033971 | Compressible foamed thermal interface materials and methods of making the same | Vijayaraghavan Rajagopal, Eugene Anthony Pruss | 2024-07-09 |
| 11776868 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Jason L. Strader | 2023-10-03 |
| 11776928 | Compressible foamed thermal interface materials and methods of making the same | Vijayaraghavan Rajagopal, Eugene Anthony Pruss | 2023-10-03 |
| 11610831 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Jason L. Strader | 2023-03-21 |
| 11276662 | Compressible foamed thermal interface materials and methods of making the same | Vijayaraghavan Rajagopal, Eugene Anthony Pruss | 2022-03-15 |
| 10964617 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Jason L. Strader | 2021-03-30 |
| 10600714 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Jason L. Strader | 2020-03-24 |
| 10373891 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Jason L. Strader | 2019-08-06 |
| 9515004 | Thermal interface materials | Jason L. Strader, Karen Bruzda | 2016-12-06 |
| 9330998 | Thermal interface material assemblies and related methods | Jason L. Strader | 2016-05-03 |
| 9322580 | Circuit assemblies including thermoelectric modules | Jeffrey Gerard Hershberger, Robert Michael Smythe, Michael G. Sutsko | 2016-04-26 |
| 9258928 | Assemblies and methods for dissipating heat from handheld electronic devices | Shahi Riaz | 2016-02-09 |
| 9222735 | Compliant multilayered thermally-conductive interface assemblies | Robert Michael Smythe | 2015-12-29 |
| 8837151 | Memory modules including compliant multilayered thermally-conductive interface assemblies | Robert Michael Smythe | 2014-09-16 |
| 8647752 | Thermal interface material assemblies, and related methods | Jason L. Strader | 2014-02-11 |
| 8649179 | Circuit assemblies including thermoelectric modules | Jeffrey Gerard Hershberger, Robert Michael Smythe, Michael G. Sutsko | 2014-02-11 |
| 8477499 | Assemblies and methods for dissipating heat from handheld electronic devices | Shahi Riaz | 2013-07-02 |
| 8081468 | Memory modules including compliant multilayered thermally-conductive interface assemblies | Robert Michael Smythe | 2011-12-20 |
| 7965514 | Assemblies and methods for dissipating heat from handheld electronic devices | Shahi Riaz | 2011-06-21 |
| 7765811 | Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits | Jeffrey Gerard Hershberger, Richard I. Roser | 2010-08-03 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink | Jason L. Strader | 2008-05-06 |
| 7078109 | Heat spreading thermal interface structure | Jason L. Strader, James R. Latham | 2006-07-18 |
| 6940721 | Thermal interface structure for placement between a microelectronic component package and heat sink | — | 2005-09-06 |
| 6849941 | Heat sink and heat spreader assembly | Jason L. Strader | 2005-02-01 |
| 6761928 | Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink | Forest Hampton, III | 2004-07-13 |