Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955438 | Thermally-conductive electromagnetic interference (EMI) absorbers | John D. Ryan | 2024-04-09 |
| 10692797 | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity | Kathryn Cancar | 2020-06-23 |
| 10306817 | Thermal management and/or EMI mitigation materials with custom colored exterior surfaces | Troy Dewayne Derksen, David B. Wood | 2019-05-28 |
| 10155896 | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity | Kathryn Cancar | 2018-12-18 |
| 10087351 | Materials including thermally reversible gels | Jason L. Strader | 2018-10-02 |
| 9828539 | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity | Kathryn Cancar | 2017-11-28 |
| 9795059 | Thermal interface materials with thin film or metallization | Jason L. Strader, Mark Wisniewski, Michael D. Craig | 2017-10-17 |
| 9771508 | Thermal interface materials including thermally reversible gels | Jason L. Strader | 2017-09-26 |
| 9515004 | Thermal interface materials | Jason L. Strader, Richard F. Hill | 2016-12-06 |
| 9260645 | Thermal interface materials including thermally reversible gels | — | 2016-02-16 |
| 8445102 | Thermal interface material with thin transfer film or metallization | Jason L. Strader, Mark Wisniewski, Michael D. Craig | 2013-05-21 |