Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369291 | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide | Hoang Dinh DO, Robert Howard Boutier, Jr., Michael S. Plante | 2025-07-22 |
| 12289876 | Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder | — | 2025-04-29 |
| 12040306 | Systems of applying materials to components | Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel | 2024-07-16 |
| 11984570 | Thermal management and/or EMI mitigation materials including coated fillers | John Song | 2024-05-14 |
| 11864366 | Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder | — | 2024-01-02 |
| 11776868 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Richard F. Hill | 2023-10-03 |
| D999405 | Material having edging | Michael S. Wladyka, Keith David Johnson, Mark D. Kittel, Jingting Yang | 2023-09-19 |
| D998827 | Material having edge shape | Michael S. Wladyka, Keith David Johnson, Mark D. Kittel, Jingting Yang | 2023-09-12 |
| 11678470 | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide | Hoang Dinh DO, Robert Howard Boutier, Jr., Michael S. Plante | 2023-06-13 |
| 11610831 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Richard F. Hill | 2023-03-21 |
| 11483948 | Thermal interface materials including memory foam cores | Kyle Burke Huffstutler, Eric Edward Trantina | 2022-10-25 |
| 11411263 | Thermal management and/or EMI mitigation materials including coated fillers | John Song | 2022-08-09 |
| 11014203 | System for applying interface materials | Mark D. Kittel | 2021-05-25 |
| 10978369 | Devices for absorbing energy from electronic components | Eugene Anthony Pruss | 2021-04-13 |
| 10964617 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Richard F. Hill | 2021-03-30 |
| 10965333 | Thermal management assemblies suitable for use with transceivers and other devices | Gerald R. English, Joseph C. Boetto, Woongho Bang, Leonid Shmagin, Eugene Anthony Pruss | 2021-03-30 |
| 10741471 | Highly compliant non-silicone putties and thermal interface materials including the same | Eugene Anthony Pruss | 2020-08-11 |
| 10741519 | Systems of applying materials to components | Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel | 2020-08-11 |
| 10687447 | Methods of applying thermal interface materials to board level shields | Sri Talpallikar | 2020-06-16 |
| D881822 | Material having an edge shape | Michael S. Wladyka, Keith David Johnson, Mark D. Kittel, Jingting Yang | 2020-04-21 |
| 10600714 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Richard F. Hill | 2020-03-24 |
| D879046 | Material having edging | Michael S. Wladyka, Keith David Johnson, Mark D. Kittel, Jingting Yang | 2020-03-24 |
| 10555439 | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components | Keith David Johnson, Douglas S. McBain, Eugene Anthony Pruss | 2020-02-04 |
| 10477738 | Board level shields and systems and methods of applying board level shielding | Eugene Anthony Pruss, Gerald R. English | 2019-11-12 |
| 10453773 | Devices for absorbing energy from electronic components | Eugene Anthony Pruss | 2019-10-22 |