Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10389397 | Small form-factor pluggable (SFP) transceivers | Björn Edgren, Karl Göran Olof Ihrefjord, Matthew Tapping, Michael Poulsen, Eugene Anthony Pruss | 2019-08-20 |
| 10373891 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Richard F. Hill | 2019-08-06 |
| 10334716 | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding | Eugene Anthony Pruss | 2019-06-25 |
| 10087351 | Materials including thermally reversible gels | Karen Bruzda | 2018-10-02 |
| 9795059 | Thermal interface materials with thin film or metallization | Mark Wisniewski, Karen Bruzda, Michael D. Craig | 2017-10-17 |
| 9781819 | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding | — | 2017-10-03 |
| 9771508 | Thermal interface materials including thermally reversible gels | Karen Bruzda | 2017-09-26 |
| 9515004 | Thermal interface materials | Karen Bruzda, Richard F. Hill | 2016-12-06 |
| 9330998 | Thermal interface material assemblies and related methods | Richard F. Hill | 2016-05-03 |
| 8647752 | Thermal interface material assemblies, and related methods | Richard F. Hill | 2014-02-11 |
| 8545987 | Thermal interface material with thin transfer film or metallization | Mark Wisniewski | 2013-10-01 |
| 8445102 | Thermal interface material with thin transfer film or metallization | Mark Wisniewski, Karen Bruzda, Michael D. Craig | 2013-05-21 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink | Richard F. Hill | 2008-05-06 |
| 7078109 | Heat spreading thermal interface structure | Richard F. Hill, James R. Latham | 2006-07-18 |
| 6849941 | Heat sink and heat spreader assembly | Richard F. Hill | 2005-02-01 |
| 6617517 | Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink | Richard F. Hill | 2003-09-09 |