Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12238827 | Base structure and wafer placing device | Yuusaku Ishimine, Yoshihiro Okawa | 2025-02-25 |
| 12183601 | Structural body and heating apparatus | Takeshi MUNEISHI, Yoshihiro Okawa | 2024-12-31 |
| 12142498 | Ceramic structure and wafer system | Yoshihiro Okawa | 2024-11-12 |
| 12016087 | Heater and method of production of same | Yoshihiro Okawa, Yuusaku Ishimine, Shinya Terao | 2024-06-18 |
| 11923227 | Electrostatic chuck and method for manufacturing same | Yoshihiro Okawa | 2024-03-05 |
| 11856659 | Board-like structure and heater system | Yoshihiro Okawa | 2023-12-26 |
| 11818813 | Wafer-use member, wafer-use system, and method for manufacturing wafer-use member | Yoshihiro Okawa | 2023-11-14 |
| 6133557 | Wafer holding member | Kazuhiro Kuchimachi, Hironori Inoue, Saburo Nagano | 2000-10-17 |
| 5886863 | Wafer support member | Koichi Nagasaki, Kazuhiro Kuchimachi, Saburo Nagano, Hiroshi Aida, Kenji Kitazawa | 1999-03-23 |
| 5677253 | Wafer holding member | Hironori Inoue, Kazuhiro Kuchimachi, Saburo Nagano, Akihiro Kukita | 1997-10-14 |