Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935864 | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods | Hui Xu, JeongHo Yang, Wei Qin | 2024-03-19 |
| 11515285 | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods | Hui Xu, JeongHo Yang, Wei Qin | 2022-11-29 |
| 10665564 | On-bonder automatic overhang die optimization tool for wire bonding and related methods | Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Wei Qin | 2020-05-26 |
| 10121759 | On-bonder automatic overhang die optimization tool for wire bonding and related methods | Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Wei Qin | 2018-11-06 |
| 8302840 | Closed loop wire bonding methods and bonding force calibration | Wei Qin, John D. Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu | 2012-11-06 |
| 7735716 | Method of controlling the trajectory of a bonding tool during the formation of a wire loop | Wei Qin, Itzhak Barkana, Igor Fokin | 2010-06-15 |