Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935864 | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods | Hui Xu, Wei Qin, Ziauddin Ahmad | 2024-03-19 |
| 11515285 | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods | Hui Xu, Wei Qin, Ziauddin Ahmad | 2022-11-29 |