Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665564 | On-bonder automatic overhang die optimization tool for wire bonding and related methods | Aashish Shah, Robert William Ellenberg, Ziauddin Ahmad, Wei Qin | 2020-05-26 |
| 10121759 | On-bonder automatic overhang die optimization tool for wire bonding and related methods | Aashish Shah, Robert William Ellenberg, Ziauddin Ahmad, Wei Qin | 2018-11-06 |
| 7651022 | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine | Takashi Tsujimura, Hiroyuki Ohtsubo, Yasuhiro Morimoto | 2010-01-26 |
| 7464854 | Method and apparatus for forming a low profile wire loop | — | 2008-12-16 |
| 7229906 | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine | Takashi Tsujimura, Hiroyuki Ohtsubo, Yasuhiro Morimoto | 2007-06-12 |
| 7188759 | Methods for forming conductive bumps and wire loops | Dodgie Reigh M. Calpito | 2007-03-13 |