TT

Takashi Tsujimura

SO Sony: 11 patents #4,043 of 25,231Top 20%
KI Kulicke And Soffa Industries: 2 patents #57 of 219Top 30%
Canon: 2 patents #12,681 of 19,416Top 70%
MA Makita: 1 patents #490 of 770Top 65%
Overall (All Time): #289,559 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12058441 Information processing apparatus with automatic adjustment of focal point 2024-08-06
11086255 Image forming apparatus Hisashi Tsukijima, Kensuke Kaneko 2021-08-10
10935919 Image forming apparatus Akira Hamano, Rin Ishikawa, Yuichiro Imai, Saimon Gokyu 2021-03-02
10225462 Image processing to track face region of person Tadasuke Murakami, Akira Tokuse 2019-03-05
8558949 Image processing device, image processing method, and image processing program Shogo Sato, Kenichi Sanpei, Akira Tokuse, Yoko Fukata, Tadasuke Murakami 2013-10-15
8254639 Image storage device, imaging device, image storage method, and program 2012-08-28
8228390 Image taking apparatus with shake correction, image processing apparatus with shake correction, image processing method with shake correction, and image processing program with shake correction Miyuki Okada, Hirofumi Nomura 2012-07-24
8009337 Image display apparatus, method, and program Manabu Kubo, Masatsugu Fukunaga, Daisuke Miyakoshi, Nobuho Ikeda, Kyoko Fukuda +1 more 2011-08-30
7986345 Image pickup apparatus, image processing method, and program Takuro Enomoto, Masatsugu Fukunaga, Daisuke Miyakoshi, Nobuho Ikeda, Manabu Kubo +3 more 2011-07-26
7719572 Image pickup apparatus, image processing method, and program Takuro Enomoto, Masatsugu Fukunaga, Daisuke Miyakoshi, Nobuho Ikeda, Manabu Kubo +3 more 2010-05-18
7705895 Image taking apparatus and image-taking method Takuro Enomoto, Yutaka Yoneda, Masatsugu Fukunaga, Daisuke Miyakoshi, Nobuho Ikeda +1 more 2010-04-27
7651022 Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine Stephen Babinetz, Hiroyuki Ohtsubo, Yasuhiro Morimoto 2010-01-26
D550152 Battery pack Shinsuke Okuda 2007-09-04
7229906 Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine Stephen Babinetz, Hiroyuki Ohtsubo, Yasuhiro Morimoto 2007-06-12
6009233 Apparatus and method for recording and reproducing a video signal with camera setting data Terumasa Funabashi, Chihiro Kaihatsu 1999-12-28
5825968 Apparatus for controlling a record operation based on a copy inhibiting signal Tetsuo Nishigaki 1998-10-20