LH

Luping Huang

KL Kla-Tencor: 4 patents #354 of 1,394Top 30%
🗺 California: #124,610 of 386,348 inventorsTop 35%
Overall (All Time): #1,184,807 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10468288 Methods and systems for chucking a warped wafer Aviv Balan, Savita Chandan, Chia-Chu Chen, Teck Meriam 2019-11-05
10381256 Apparatus and method for chucking warped wafers Pradeep Subrahmanyan, Chris Pohlhammer 2019-08-13
9960070 Chucking warped wafer with bellows 2018-05-01
9653338 System and method for non-contact wafer chucking 2017-05-16