Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8042725 | Wire bonding method, wire bonding apparatus, and wire bonding control program | Toru Arahata, Hiromi Fujisawa | 2011-10-25 |
| 7748599 | Wire bonding method, wire bonding apparatus, and wire bonding control program | Toru Arahata, Hiromi Fujisawa | 2010-07-06 |
| 6715666 | Wire bonding method, method of forming bump and bump | Rei Imai, Tamanari Yasuda, Yuji Kosaku | 2004-04-06 |