Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7815095 | Wire loop, semiconductor device having same and wire bonding method | Hiromi Fujisawa, Masaru Ishibashi | 2010-10-19 |
| 6715666 | Wire bonding method, method of forming bump and bump | Tamanari Yasuda, Shinobu Ishii, Yuji Kosaku | 2004-04-06 |