HF

Hiromi Fujisawa

KA Kaijo: 6 patents #2 of 83Top 3%
Overall (All Time): #866,570 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
8042725 Wire bonding method, wire bonding apparatus, and wire bonding control program Toru Arahata, Shinobu Ishii 2011-10-25
8016182 Wire loop, semiconductor device having same and wire bonding method Mizuho Shirato, Tadahisa Akita 2011-09-13
7815095 Wire loop, semiconductor device having same and wire bonding method Masaru Ishibashi, Rei Imai 2010-10-19
7748599 Wire bonding method, wire bonding apparatus, and wire bonding control program Toru Arahata, Shinobu Ishii 2010-07-06
7262124 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus 2007-08-28
6933608 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus 2005-08-23