Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5438113 | Thermosetting resin composition | Hiroshi Shimozawa, Shuzi Hayase, Yoshihiko Nakano, Akira Yoshizumi, Ken Uchida | 1995-08-01 |
| 5346743 | Resin encapsulation type semiconductor device | Ken Uchida, Michiya Higashi | 1994-09-13 |
| 5272377 | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition | Hiroshi Shimozawa, Michiya Higashi, Akira Yoshizumi | 1993-12-21 |
| 5258426 | Semiconductor device encapsulant | Ken Uchida, Michiya Higashi, Hiroshi Shimozawa, Akira Yoshizumi | 1993-11-02 |
| 5252639 | Molding resin composition and molded electronic component | Akira Yoshizumi, Kazutaka Matsumoto, Hisayuki Hirai | 1993-10-12 |
| 5223739 | Plastic molded semiconductor device having waterproof cap | Akio Katsumata, Seiichi Hirata, Hiroshi Shimozawa | 1993-06-29 |
| 5216077 | Rubber-modified phenolic resin composition and method of manufacturing the same | Akira Yoshizumi, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata +2 more | 1993-06-01 |
| 5043211 | Epoxy resin composition and a resin-sealed semiconductor device | Akira Yoshizumi, Kazutaka Matsumoto, Ken Uchida | 1991-08-27 |
| 4916174 | Rubber-modified phenolic resin composition and method of manufacturing the same | Akira Yoshizumi, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata +2 more | 1990-04-10 |
| 4719255 | Epoxy resin composition for encapsulation of semi-conductor device | Akira Yoshizumi, Hisayuki Hirai, Kazutaka Matsumoto, Michiya Higashi | 1988-01-12 |