Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D480371 | Semiconductor device | Masahiro Ootomo, Kazuyoshi Fukuda, Takahiro Ide | 2003-10-07 |
| D473199 | Portion of semiconductor device | Masahiro Ootomo, Kazuyoshi Fukuda, Takahiro Ide | 2003-04-15 |
| 5561324 | Semiconductor chip mounting sector | Hiroyuki Kozono, Hiromichi Sawaya | 1996-10-01 |
| 5317194 | Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink | — | 1994-05-31 |
| 5245216 | Plastic-molded type semiconductor device | — | 1993-09-14 |
| 5049977 | Plastic molded type semiconductor device | — | 1991-09-17 |
| 4984065 | Hybrid resin-sealed semiconductor device | — | 1991-01-08 |
| 4942456 | Plastic packaged device having a hollow portion enclosing a chip element | — | 1990-07-17 |