Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608387 | Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate | — | 2003-08-19 |
| 6496016 | Semiconductor device for use in evaluating integrated circuit device | — | 2002-12-17 |
| 6177718 | Resin-sealed semiconductor device | — | 2001-01-23 |
| 6107689 | Semiconductor device | — | 2000-08-22 |
| 5910681 | Resin sealed semiconductor device | — | 1999-06-08 |
| 5909054 | Semiconductor device having a multiple-terminal integrated circuit formed on a circuit substrate | — | 1999-06-01 |
| 5796160 | Resin-sealed semiconductor device | — | 1998-08-18 |
| 5731632 | Semiconductor device having a plastic package | — | 1998-03-24 |
| 5619070 | Semiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chip | — | 1997-04-08 |
| 5581123 | Semiconductor device and its manufacturing method | — | 1996-12-03 |
| 5561324 | Semiconductor chip mounting sector | Shigeki Sako, Hiromichi Sawaya | 1996-10-01 |
| 5532514 | High frequency semiconductor device | — | 1996-07-02 |
| 5497031 | Semiconductor device having semiconductor chip with backside electrode | — | 1996-03-05 |
| 5434450 | PGA package type semiconductor device having leads to be supplied with power source potential | — | 1995-07-18 |
| 5420459 | Resin encapsulation type semiconductor device having an improved lead configuration | — | 1995-05-30 |
| 5399904 | Array type semiconductor device having insulating circuit board | — | 1995-03-21 |