Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5561324 | Semiconductor chip mounting sector | Hiroyuki Kozono, Shigeki Sako | 1996-10-01 |
| 5352632 | Multichip packaged semiconductor device and method for manufacturing the same | — | 1994-10-04 |
| 5314842 | Resin-sealed type semiconductor device and method for manufacturing the same | Toshio Ishigami | 1994-05-24 |
| 5245215 | Multichip packaged semiconductor device and method for manufacturing the same | — | 1993-09-14 |
| 5196992 | Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin | — | 1993-03-23 |
| 5191511 | Semiconductor device including a package having a plurality of bumps arranged in a grid form as external terminals | — | 1993-03-02 |
| 5136827 | Wrapping member for semiconductor device and method for manufacturing the wrapping member | — | 1992-08-11 |
| 5124783 | Semiconductor device having insulating substrate adhered to conductive substrate | — | 1992-06-23 |
| 5093713 | Semiconductor device package | — | 1992-03-03 |
| 5083189 | Resin-sealed type IC device | — | 1992-01-21 |
| 4963975 | Semiconductor device | — | 1990-10-16 |
| 4951124 | Semiconductor device | — | 1990-08-21 |
| 4807087 | Single-in-line type semiconductor device | — | 1989-02-21 |