Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700327 | Secondary battery | Ikuo Uematsu, Naoya Hayamizu | 2020-06-30 |
| 10135050 | Secondary battery | Ikuo Uematsu, Naoya Hayamizu | 2018-11-20 |
| 9692052 | Electrode material for battery, electrode material paste for battery, and solar cell using same, storage battery, and method for manufacturing solar cell | Yoko Tokuno, Tomomichi Naka, Akito Sasaki, Shuzi Hayase | 2017-06-27 |
| 9303976 | Substrate processing system and substrate processing program | Masahiro Uekita, Hiroshi Koizumi, Tomomichi Naka, Eijiro Koike | 2016-04-05 |
| 9099619 | Semiconductor light emitting device and method for manufacturing the same | Hiroshi Koizumi, Yoshiaki Sugizaki, Yasuhide Okada, Tomomichi Naka, Masahiro Uekita +2 more | 2015-08-04 |
| 8614500 | Film forming apparatus, film forming method, and semiconductor device | Tsuyoshi Sato, Hiroyasu Kondo, Katsuyuki Soeda, Kenichi Ooshiro, Shuichi Kimura | 2013-12-24 |
| 8535765 | Method of producing a low-molecular luminous material dispersant, an apparatus for producing a low-molecular luminous material dispersant and a low-molecular luminous material dispersant | Hiroyasu Kondo, Hiroshi Koizumi | 2013-09-17 |
| 8490571 | Coater, method for manufacturing coated article, and fluid blowing unit | Tsuyoshi Sato, Hiroyasu Kondo, Junsei Yamabe, Katsuyuki Soeda, Hiroshi Koizumi +2 more | 2013-07-23 |
| 8419178 | Ink-jet application method and display device producing method | — | 2013-04-16 |
| 8201922 | Method of applying ink-repellent film and nozzle plate provided with ink-repellent film | Masakuni Ikagawa | 2012-06-19 |
| 8136920 | Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge apparatus | Junsei Yamabe, Hiroshi Koizumi | 2012-03-20 |
| 8132903 | Ink jet system and method for removing air bubbles inside of an ink jet nozzle | Tsuyoshi Sato, Hiroyasu Kondo | 2012-03-13 |
| 8039858 | Fluorescer solution, light-emitting device, and method for manufacturing same | Junsei Yamabe, Hiroshi Koizumi | 2011-10-18 |
| 7884020 | Polishing cloth and method of manufacturing semiconductor device | Hideaki Hirabayashi, Akiko Saito, Koji Sato, Tomiho Yamada | 2011-02-08 |
| 7814919 | Ultrasonic cleaning apparatus | Hiroshi Fujita | 2010-10-19 |
| 7799728 | Photocatalyst dispersing element, method for manufacturing photocatalyst dispersing element, photocatalyst element, method for manufacturing photocatalyst element | Junsei Yamabe, Nobuaki Makino | 2010-09-21 |
| 7632359 | Cleaning liquid and nozzle plate cleaning method | Junsei Yamabe | 2009-12-15 |
| 7291188 | Polishing cloth and method of manufacturing semiconductor device | Hideaki Hirabayashi, Akiko Saito, Koji Sato, Tomiho Yamada | 2007-11-06 |
| 7226513 | Silicon wafer cleaning method | Hisatsugu Kurita, Manabu Hirasawa, Hiromi Nagahama, Koji Izumome, Takao Ino +2 more | 2007-06-05 |
| 7112125 | Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices | Hideaki Hirabayashi, Akiko Saito, Yoshihiro Oshibe, Masahiro Ishidoya | 2006-09-26 |
| 6875696 | Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display | Hiroshi Fujita | 2005-04-05 |
| 6861010 | COPPER-BASED METAL POLISHING COMPOSITION, METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, POLISHING COMPOSITION, ALUMINUM-BASED METAL POLISHING COMPOSITION, AND TUNGSTEN-BASED METAL POLISHING COMPOSITION | Hideaki Hirabayashi, Toshitsura Cho, Shumpei Shimizu, Katsuhiro Kato, Akiko Saito | 2005-03-01 |
| 6521574 | Copper-based metal polishing solution and method for manufacturing a semiconductor device | Hideaki Hirabayashi | 2003-02-18 |
| 6444255 | Method for producing liquid crystal display and method for cleaning substrate | Yoshiyuki Nagahara, Naoya Hayamizu, Noriko Okoshi, Toshitaka Nonaka, Hiroaki Furuya | 2002-09-03 |
| 6426294 | COPPER-BASED METAL POLISHING COMPOSITION, METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, POLISHING COMPOSITION, ALUMINUM-BASED METAL POLISHING COMPOSITION, AND TUNGSTEN-BASED METAL POLISHING COMPOSITION | Hideaki Hirabayashi, Toshitsura Cho, Shumpei Shimizu, Katsuhiro Kato, Akiko Saito | 2002-07-30 |