Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7784764 | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material | Takaki Kuno, Yoshinori Noguchi, Keiji Maeda, Seiichi Suda, Satoshi Kitaoka +1 more | 2010-08-31 |
| 7614293 | Method of evaluating adhesion property, low-adhesion material, and mold for molding resin | Takaki Kuno, Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima +2 more | 2009-11-10 |