Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11939691 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | Syohei Yamaguchi, Hiroki Ishida, Masaru HATABE | 2024-03-26 |
| 11052637 | Structure containing Sn layer or Sn alloy layer | Masaru HATABE, Takahiro Tanaka, Fuka Yamaoka | 2021-07-06 |
| 10062657 | Method for manufacturing alloy bump | Masaru HATABE | 2018-08-28 |