Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388035 | Structure comprising under barrier metal and solder layer, and method for producing structure | Takahiro Tanaka, Hironori Yamada | 2025-08-12 |
| 11993862 | Structure including copper plating layer or copper alloy plating layer | Hironori Murakami, Fuka Yamaoka | 2024-05-28 |
| 11946153 | Copper or copper alloy electroplating bath | Hironori Murakami, Fuka Yamaoka | 2024-04-02 |
| 11939691 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | Syohei Yamaguchi, Hiroki Ishida, Shoya Iuchi | 2024-03-26 |
| 11052637 | Structure containing Sn layer or Sn alloy layer | Shoya Iuchi, Takahiro Tanaka, Fuka Yamaoka | 2021-07-06 |
| 10062657 | Method for manufacturing alloy bump | Shoya Iuchi | 2018-08-28 |