Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993862 | Structure including copper plating layer or copper alloy plating layer | Masaru HATABE, Hironori Murakami | 2024-05-28 |
| 11946153 | Copper or copper alloy electroplating bath | Masaru HATABE, Hironori Murakami | 2024-04-02 |
| 11052637 | Structure containing Sn layer or Sn alloy layer | Shoya Iuchi, Masaru HATABE, Takahiro Tanaka | 2021-07-06 |