Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9030025 | Integrated circuit layout | Chao Yuan Huang, Ming-Sheng Yang, Hwi-Huang Chen | 2015-05-12 |
| 8952500 | Semiconductor device | Chao Yuan Huang, Ming-Sheng Yang, Hwi-Huang Chen | 2015-02-10 |
| 8890607 | Stacked chip system | Chao Yuan Huang, Ming-Sheng Yang, Hwi-Huang Chen | 2014-11-18 |
| 8853090 | Method for fabricating a through-silicon via | Chao Yuan Huang, Ming-Sheng Yang, Hwi-Huang Chen | 2014-10-07 |
| 6518164 | Etching process for forming the trench with high aspect ratio | Yann-Pyng Wu | 2003-02-11 |
| 6258713 | Method for forming dual damascene structure | Chia-Chieh Yu | 2001-07-10 |
| 6136694 | Method for forming via hole | — | 2000-10-24 |
| 6133143 | Method of manufacturing interconnect | Jy-Hwang Lin, Ching-Hsing Hsieh, Chia-Chieh Yu | 2000-10-17 |
| 6083825 | Method of forming unlanded via hole | Jy-Hwang Lin, Pei-Jen Wang | 2000-07-04 |
| 5882537 | Metallic precipitate monitoring method | Chia-Chieh Yu | 1999-03-16 |