Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7635636 | Wafer level packaging of materials with different coefficients of thermal expansion | Jack Chocola, Kevin Lin, George Grama | 2009-12-22 |
| 7109635 | Wafer level packaging of materials with different coefficients of thermal expansion | Jack Chocola, Kevin Lin, George Grama | 2006-09-19 |
| 5580380 | Method for forming a diamond coated field emitter and device produced thereby | Jiang Liu, Scott D. Wolter, Brian R. Stoner, Jeffrey T. Glass, John J. Hren | 1996-12-03 |