Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7421777 | Method of manufacturing multilayer wiring substrate using temporary metal support layer | Hiroshi Asami, Hidetoshi Kusano, Ken Orui | 2008-09-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7421777 | Method of manufacturing multilayer wiring substrate using temporary metal support layer | Hiroshi Asami, Hidetoshi Kusano, Ken Orui | 2008-09-09 |