Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469148 | Semiconductor package having a redistribution layer for package-on-package structure | Youngkwan Lee, Youngsik Hur, Taehee Han, Yonghoon Kim | 2022-10-11 |
| 11205631 | Semiconductor package including multiple semiconductor chips | Yonghoon Kim, Jaehyun LIM, Sayoon Kang | 2021-12-21 |