Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626362 | Semiconductor package | Junghyun Cho, Youngsik Hur, Jongrok Kim | 2023-04-11 |
| 11469148 | Semiconductor package having a redistribution layer for package-on-package structure | Youngsik Hur, Taehee Han, Yonghoon Kim, Yuntae Lee | 2022-10-11 |
| 11239148 | Semiconductor package | Youngsik Hur, Taehee Han | 2022-02-01 |
| 11031328 | Semiconductor package | Junghyun Cho, Youngsik Hur, Jongrok Kim | 2021-06-08 |