| 8960266 |
Semiconductor wafer transport method and semiconductor wafer transport apparatus |
Masayuki Yamamoto |
2015-02-24 |
| 8349106 |
Adhesive tape joining method and adhesive tape joining apparatus |
Saburo Miyamoto, Masayuki Yamamoto |
2013-01-08 |
| 8109185 |
Method for cutting protective tape of semiconductor wafer and protective tape cutting device |
Masayuki Yamamoto, Yasuji Kaneshima |
2012-02-07 |
| 8038816 |
Method and apparatus for separating protective tape from semiconductor wafer |
Masayuki Yamamoto |
2011-10-18 |
| 7811899 |
Method for laminating substrate and apparatus using the method |
Masayuki Yamamoto |
2010-10-12 |
| 7807004 |
Method for joining adhesive tape |
Masayuki Yamamoto |
2010-10-05 |
| 7393757 |
Method for separating semiconductor wafer from supporting member, and apparatus using the same |
Saburo Miyamoto |
2008-07-01 |
| 7384811 |
Method of separating semiconductor wafer, and separating apparatus using the same |
Saburo Miyamoto |
2008-06-10 |
| 7078316 |
Substrate joining apparatus |
Saburo Miyamoto, Masaru Irie |
2006-07-18 |