Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8952531 | Packaging method using solder coating ball and package having solder pattern including metal pattern | Jin Won Choi | 2015-02-10 |
| 8740040 | Solder injection head | Jin Won Choi, Ki-ju Lee | 2014-06-03 |
| 8708215 | Solder ball supplying apparatus | Hueng Jae Oh, Jin Won Choi | 2014-04-29 |