Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11151350 | Electronic device and method of registering fingerprint in electronic device | Seung Yun Lee, Dong Kyu Kim, Je-Yeong Jeong | 2021-10-19 |
| 10621407 | Electronic device and method of registering fingerprint in electronic device | Seung Yun Lee, Dong Kyu Kim, Je-Yeong Jeong | 2020-04-14 |
| 10262181 | Electronic device and method of registering fingerprint in electronic device | Seung Yun Lee, Dong Kyu Kim, Je-Yeong Jeong | 2019-04-16 |
| 9881198 | Electronic device and method of registering fingerprint in electronic device | Seung Yun Lee, Dong Kyu Kim, Je-Yeong Jeong | 2018-01-30 |
| 9466589 | Power module package including heat spreader and inductance coil | Kwang Soo Kim, Chang Seob Hong, Joon Seok Chae, Kee Ju Um | 2016-10-11 |
| 9455207 | All-in-one power semiconductor module | Kwang Soo Kim, Si Joong Yang, Bum Seok Suh, Job Ha | 2016-09-27 |
| 9443818 | Power semiconductor module | Kwang Soo Kim, Joon Seok Chae, Chang Seob Hong, Young Ki Lee | 2016-09-13 |
| 9153514 | Power module package | Young Ho Sohn, Jong-Man Kim, Kyu Hwan Oh, Tae Hyun Kim | 2015-10-06 |
| 9153564 | Power module package and method of manufacturing the same | Kwang Soo Kim, Joon Seok Chae | 2015-10-06 |
| D719926 | Semiconductor device | Young Ho Sohn, Si Joong Yang, Young Ki Lee, Jin Su Kim, Dong Hwan Kim +3 more | 2014-12-23 |
| D719113 | Semiconductor device | Young Ho Sohn, Si Joong Yang, Young Ki Lee, Jin Su Kim, Dong Hwan Kim +3 more | 2014-12-09 |
| 8897011 | Heat dissipation system for power module | Jong-Man Kim, Young Ho Sohn | 2014-11-25 |
| D717253 | Semiconductor device | Eun Jung Jo, Jin Suk Son, Job Ha, Jae Hoon Park, Chang Seob Hong +3 more | 2014-11-11 |
| 8866288 | Semiconductor package | Jong-Man Kim, Chang Seob Hong, Soon Gyu Yim | 2014-10-21 |
| 8816515 | Semiconductor module having sliding case and manufacturing method thereof | Young Ki Lee, Kwang Soo Kim, Sun Woo Yun | 2014-08-26 |
| 8810014 | Semiconductor package including conductive member disposed between the heat dissipation member and the lead frame | Jae Hyun Lim, Chang Seob Hong, Young Ho Sohn | 2014-08-19 |
| 8796730 | Power semiconductor module | Young Ki Lee, Dong Soo Seo, Kwang Soo Kim | 2014-08-05 |
| 8736077 | Semiconductor package substrate | Jong-Man Kim, Kyu Hwan Oh, Seog Moon Choi, Tae Hoon Kim | 2014-05-27 |
| 8729692 | Power module package | Kwang Soo Kim, Young Ki Lee | 2014-05-20 |
| 8598702 | Semiconductor package | Kwang Soo Kim, Young Ki Lee | 2013-12-03 |