Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626434 | Image sensor package | Wei-Feng Lin, Ying Chung | 2023-04-11 |
| 11211414 | Image sensor package | Wei-Feng Lin, Ying Chung | 2021-12-28 |
| 11114483 | Cavityless chip-scale image-sensor package | Chien-Chan Yeh, Wei-Feng Lin, Chun-Sheng Fan | 2021-09-07 |
| 11056529 | Image-sensor chip-scale package and method for manufacture | Chien-Chan Yeh | 2021-07-06 |
| 10998285 | Code pattern for representing tracing number of chip | Chien-Chan Yeh | 2021-05-04 |
| 10985149 | Semiconductor device package and method of manufacturing the same | Chien-Chan Yeh, Wei-Feng Lin | 2021-04-20 |
| 10199333 | Delamination-resistant semiconductor device and associated method | Ying Chung | 2019-02-05 |
| 10020335 | Short-resistant chip-scale package | Wei-Chih Chien | 2018-07-10 |
| 9922922 | Microchip with cap layer for redistribution circuitry and method of manufacturing the same | Chi-Kuei Lee, Ying Chung, Wei-Feng Lin | 2018-03-20 |