Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922922 | Microchip with cap layer for redistribution circuitry and method of manufacturing the same | Ying Chung, Ying-Chih Kuo, Wei-Feng Lin | 2018-03-20 |
| 9443894 | Imaging package with removable transparent cover | Wei-Feng Lin | 2016-09-13 |
| 8665364 | Reinforcement structure for wafer-level camera module | Wei-Feng Lin, Wen-Jen Ho, Chen-Wei Tsai | 2014-03-04 |
| 7929033 | Image sensor package and camera module having same | Ying-Cheng Wu | 2011-04-19 |
| 7696465 | Image sensor package, camera module having same and manufacturing method for the same | Ying-Cheng Wu, Shih-Min Wang | 2010-04-13 |