Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831167 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Shuo-Hsun Chang, Yu-Te Lu, Kuo-Chun Huang | 2017-11-28 |
| 9754870 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Shuo-Hsun Chang, Yu-Te Lu, Kuo-Chun Huang | 2017-09-05 |
| 9439292 | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure | Ting-Hao Lin, Jaen-Don Lan, Yung-Lin Chia, An-Ping Tseng | 2016-09-06 |
| 9406641 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Shuo-Hsun Chang, Yu-Te Lu, Kuo-Chun Huang | 2016-08-02 |
| 9301405 | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole | Ting-Hao Lin, Jaen-Don Lan, Yu-Te Lu, Yung-Lin Chia, An-Ping Tseng | 2016-03-29 |