Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040416 | Far-infrared sensor packaging structure | Yen-Hsin Chen, Chi-Chih Shen | 2024-07-16 |
| 11990557 | Miniaturized optical sensor package and manufacturing method thereof | Chi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang | 2024-05-21 |
| 11747742 | Apparatus and method for removing photoresist layer from alignment mark | Yuan-Chun CHAO, Tian-Wen Liao, Wei-Chuan Chen, Yu-Ming Tseng | 2023-09-05 |
| 11495697 | Optical component packaging structure | Yen-Hsin Chen, Chi-Chih Shen | 2022-11-08 |
| 10896983 | Optical component packaging structure | Yen-Hsin Chen, Chi-Chih Shen | 2021-01-19 |
| 10439077 | Optical component packaging structure | Yen-Hsin Chen, Chi-Chih Shen | 2019-10-08 |
| 10002975 | Optical component packaging structure | Yen-Hsin Chen, Chi-Chih Shen | 2018-06-19 |
| 9741875 | Sensor chip package structure and manufacturing method thereof | Chi-Chih Shen, Yen-Hsin Chen | 2017-08-22 |
| 9536914 | Front side illuminated semiconductor structure with improved light absorption efficiency | Sen-Huang Huang, Huan-Kun Pan, Ching-Wei Chen | 2017-01-03 |
| 9142529 | Chip package with improved heat dissipation and manufacturing method thereof | Yen-Hsin Chen, Chi-Chih Shen | 2015-09-22 |