| 12040416 |
Far-infrared sensor packaging structure |
Yi-Chang Chang, Chi-Chih Shen |
2024-07-16 |
| 11495697 |
Optical component packaging structure |
Yi-Chang Chang, Chi-Chih Shen |
2022-11-08 |
| 10896983 |
Optical component packaging structure |
Yi-Chang Chang, Chi-Chih Shen |
2021-01-19 |
| 10439077 |
Optical component packaging structure |
Yi-Chang Chang, Chi-Chih Shen |
2019-10-08 |
| 10002975 |
Optical component packaging structure |
Yi-Chang Chang, Chi-Chih Shen |
2018-06-19 |
| 9976898 |
Optical sensing module with multi-directional optical sensing function |
Chi-Chih Shen, Jen-Yu Chen, Kuo-Hsiung Li, Jui-Cheng Chuang |
2018-05-22 |
| 9741875 |
Sensor chip package structure and manufacturing method thereof |
Chi-Chih Shen, Yi-Chang Chang |
2017-08-22 |
| 9142529 |
Chip package with improved heat dissipation and manufacturing method thereof |
Yi-Chang Chang, Chi-Chih Shen |
2015-09-22 |
