| 12040416 |
Far-infrared sensor packaging structure |
Yen-Hsin Chen, Chi-Chih Shen |
2024-07-16 |
| 11990557 |
Miniaturized optical sensor package and manufacturing method thereof |
Chi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang |
2024-05-21 |
| 11747742 |
Apparatus and method for removing photoresist layer from alignment mark |
Yuan-Chun CHAO, Tian-Wen Liao, Wei-Chuan Chen, Yu-Ming Tseng |
2023-09-05 |
| 11495697 |
Optical component packaging structure |
Yen-Hsin Chen, Chi-Chih Shen |
2022-11-08 |
| 10896983 |
Optical component packaging structure |
Yen-Hsin Chen, Chi-Chih Shen |
2021-01-19 |
| 10439077 |
Optical component packaging structure |
Yen-Hsin Chen, Chi-Chih Shen |
2019-10-08 |
| 10002975 |
Optical component packaging structure |
Yen-Hsin Chen, Chi-Chih Shen |
2018-06-19 |
| 9741875 |
Sensor chip package structure and manufacturing method thereof |
Chi-Chih Shen, Yen-Hsin Chen |
2017-08-22 |
| 9536914 |
Front side illuminated semiconductor structure with improved light absorption efficiency |
Sen-Huang Huang, Huan-Kun Pan, Ching-Wei Chen |
2017-01-03 |
| 9142529 |
Chip package with improved heat dissipation and manufacturing method thereof |
Yen-Hsin Chen, Chi-Chih Shen |
2015-09-22 |
