Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866311 | Semiconductor package substrates having pillars and related methods | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng | 2014-10-21 |
| 8686568 | Semiconductor package substrates having layered circuit segments, and related methods | Sheng-Ming Wang, Hsiang-Ming Feng | 2014-04-01 |