Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6937044 | Bare die carrier | Fariborz Agahdel, Brad Griswold, Syed A. Husain, Robert Moti, Chung W. Ho | 2005-08-30 |
| 6085415 | Methods to produce insulated conductive through-features in core materials for electric packaging | Pradeep Gandhi, Samuel Fu, Gary E. Legerton, Daniel BAXTER | 2000-07-11 |
| 6049215 | Bare die carrier | Fariborz Agahdel, Brad Griswold, Syed A. Husain, Robert Moti, Chung W. Ho | 2000-04-11 |
| 5998859 | Packaging and interconnect system for integrated circuits | Bradley L. Griswold, Chung W. Ho | 1999-12-07 |
| 5796164 | Packaging and interconnect system for integrated circuits | Mark T. McGraw, Bradley L. Griswold, Chung W. Ho, Byoung-Youl Min, Michael I. Grove | 1998-08-18 |
| 5508558 | High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion | Chung W. Ho | 1996-04-16 |
| 5456404 | Method of testing semiconductor chips with reusable test package | Chung W. Ho | 1995-10-10 |
| 5422514 | Packaging and interconnect system for integrated circuits | Bradley L. Griswold, Chung W. Ho | 1995-06-06 |
| 5402077 | Bare die carrier | Fariborz Agahdel, Brad Griswold, Syed A. Husain, Robert Moti, Chung W. Ho | 1995-03-28 |