| 10555417 |
Mainboard assembly including a package overlying a die directly attached to the mainboard |
Damion Searls, Margaret D. Ramirez, James Jackson, Rainer Thomas, Charles A. Gealer |
2020-02-04 |
| 10251273 |
Mainboard assembly including a package overlying a die directly attached to the mainboard |
Damion Searls, Margaret D. Ramirez, James Jackson, Rainer Thomas, Charles A. Gealer |
2019-04-02 |
| 7495318 |
Apparatus and method for improving AC coupling on circuit boards |
Damion Searls, James Jackson |
2009-02-24 |
| 7361988 |
Apparatuses and methods to route line to line |
Thomas Morgan, James Jackson |
2008-04-22 |
| 7334325 |
Apparatus and method for improving coupling across plane discontinuities on circuit boards |
Jayne Mershon, Xang Moua, Jason A. Mix |
2008-02-26 |
| 7282647 |
Apparatus for improving coupling across plane discontinuities on circuit boards |
Jayne Mershon, Xang Moua, Jason A. Mix |
2007-10-16 |
| 7255492 |
Electro-optic surface mount light pipe and connector |
Damion Searls, Thomas Morgan, James Jackson |
2007-08-14 |
| 7135758 |
Surface mount solder method and apparatus for decoupling capacitance and process of making |
Damion Searls, James Jackson |
2006-11-14 |
| 7122891 |
Ceramic embedded wireless antenna |
Terrance Dishongh, Damion Searls, Tom E. Pearson |
2006-10-17 |
| 6905979 |
Apparatus and method for improving AC coupling on circuit boards |
Damion Searls, James Jackson |
2005-06-14 |
| 6884087 |
Socket with multiple contact pad area socket contacts |
Damion Searls, Thomas Morgan |
2005-04-26 |
| 6793503 |
Ganged land grid array socket contacts for improved power delivery |
Terrance Dishongh, Damion Searls |
2004-09-21 |
| 6793505 |
Ganged land grid array socket contacts for improved power delivery |
Terrance Dishongh, Damion Searls |
2004-09-21 |
| 6713871 |
Surface mount solder method and apparatus for decoupling capacitance and process of making |
Damion Searls, James Jackson |
2004-03-30 |