Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12251081 | Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes | Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng | 2025-03-18 |
| 12064090 | Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs | Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Chun-Sheng Fan | 2024-08-20 |
| 12062673 | Apparatus and method for curved-surface image sensor | Chun-Sheng Fan | 2024-08-13 |
| 11973098 | Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same | En-Chi Li, Chi-Chih Huang | 2024-04-30 |
| 11943525 | Electronic camera module with integral LED and light-pipe illuminator | Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng | 2024-03-26 |
| D1017438 | Ring for pulse wave tracking | Haiquan Yuan, Xiaobo Zeng, Jianjun Wang, Jun Hu, Congcong Zhou | 2024-03-12 |
| 11626434 | Image sensor package | Ying-Chih Kuo, Ying Chung | 2023-04-11 |
| 11583171 | Surface-mount device platform and assembly | Teng-Sheng Chen, Chien-Chan Yeh, Cheng-Fang Chiu | 2023-02-21 |
| 11562928 | Laser marked code pattern for representing tracing number of chip | Chi-Chih Huang | 2023-01-24 |
| 11520197 | Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture | Chun-Sheng Fan | 2022-12-06 |
| 11515347 | Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same | En-Chi Li, Chi-Chih Huang | 2022-11-29 |
| 11404844 | Semiconductor structure and method of manufacturing the same | Chun-Sheng Fan | 2022-08-02 |
| 11320663 | Diffractive optical elements made of conductive materials | Chun-Sheng Fan | 2022-05-03 |
| 11211414 | Image sensor package | Ying-Chih Kuo, Ying Chung | 2021-12-28 |
| 11172806 | Medical micro-cable structure and connection method with mini camera cube chip | Teng-Sheng Chen, Xiang XIONG | 2021-11-16 |
| 11114483 | Cavityless chip-scale image-sensor package | Chien-Chan Yeh, Ying-Chih Kuo, Chun-Sheng Fan | 2021-09-07 |
| 11075239 | Anti-reflective coating with high refractive index material at air interface | Chun-Sheng Fan, Chen-Wei Tsai | 2021-07-27 |
| 10998361 | Image-sensor package and associated method | Chun-Sheng Fan | 2021-05-04 |
| 10985149 | Semiconductor device package and method of manufacturing the same | Chien-Chan Yeh, Ying-Chih Kuo | 2021-04-20 |
| 10868945 | Light-field camera and method using wafer-level integration process | Teng-Sheng Chen, Jau-Jan Deng, Chia-Yang Chang | 2020-12-15 |
| 10644048 | Anti-reflective coating with high refractive index material at air interface | Chun-Sheng Fan, Chen-Wei Tsai | 2020-05-05 |
| 10312276 | Image sensor package to limit package height and reduce edge flare | Wei-Chih Chien | 2019-06-04 |
| 10256266 | Chip-scale image sensor package and associated method of making | Chen-Wei Tsai, Chun-Sheng Fan | 2019-04-09 |
| 10243014 | System-in-package image sensor | Chi-Chih Huang, En-Chi Li | 2019-03-26 |
| 10204947 | Cover-glass-free array camera with individually light-shielded cameras | Teng-Sheng Chen, Jau-Jan Deng, Chia-Yang Chang | 2019-02-12 |