Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107028 | Thermally enhanced FCBGA package | KyungOe Kim, DongSam Park | 2024-10-01 |
| 12074135 | Semiconductor device and method of controlling warpage during LAB | KyungOe Kim | 2024-08-27 |
| 11929334 | Die-beam alignment for laser-assisted bonding | KyungOe Kim, TaeKeun Lee | 2024-03-12 |
| 11817357 | Region-of-interest positioning for laser-assisted bonding | KyungOe Kim | 2023-11-14 |
| 11688718 | Semiconductor device and method of controlling warpage during LAB | KyungOe Kim | 2023-06-27 |
| 11670563 | Thermally enhanced FCBGA package | KyungOe Kim, DongSam Park | 2023-06-06 |