Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658046 | Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof | Shih-Chun Chen, Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu | 2023-05-23 |
| 11587808 | Chip carrier device | Shih-Chun Chen, Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ying Chen | 2023-02-21 |
| 11410945 | Semiconductor package having partial outer metal layer and packaging method thereof | Shih-Chun Chen, Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ying Chen | 2022-08-09 |