Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7253363 | Circuit board | Shota Iwasaki | 2007-08-07 |
| 6815619 | Circuit board | Shota Iwasaki | 2004-11-09 |
| 6265760 | Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same | Michihiko Ichinose, Kenji Oyachi | 2001-07-24 |
| 6259152 | Hybrid leadframe having conductive leads less deformable and semiconductor device using the same | Hiromitsu Takeda, Michihiko Ichinose, Ken Fukamachi | 2001-07-10 |
| 6255742 | Semiconductor package incorporating heat dispersion plate inside resin molding | — | 2001-07-03 |
| 6166443 | Semiconductor device with reduced thickness | Michihiko Ichinose, Kenji Oyachi | 2000-12-26 |
| 6093958 | Lead-on-chip type semiconductor device having thin plate and method for manufacturing the same | — | 2000-07-25 |
| 6054753 | Plastic-encapsulated semiconductor device equipped with LOC package structure | — | 2000-04-25 |
| 5757067 | Resin-sealed type semiconductor device | — | 1998-05-26 |
| 5635220 | Molding die for sealing semiconductor device with reduced resin burrs | Atsuhiko Izumi, Kousuke Azuma | 1997-06-03 |